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Benefits of energetic ion bombardment for tailoring stress and microstructural evolution during growth of Cu thin films

Benefits of energetic ion bombardment for tailoring stress and microstructural evolution during growth of Cu thin films

Cemin, Felipe; Abadias, Gregory; Minea, Tiberiu; Furgeaud, Clarisse; Brisset, François; Solas, Denis; Lundin, Daniel
  • 期刊名称Acta Materialia
  • 作者Cemin, Felipe; Abadias, Gregory; Minea, Tiberiu; Furgeaud, Clarisse; Brisset, François; Solas, Denis; Lundin, Daniel
  • 印刷ISSN1359-6454
  • 文件大小2835.42KB
  • 发表时间2017-9
  • DOI10.1016/j.actamat.2017.09.007
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