[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Cu/adhesive hybrid bonding through a Cu-first bonding approach by using H-containing HCOOH vapor surface treatment
He, Ran; Fujino, Masahisa; Akaike, Masatake; Suga, Tadatomo; Sakai, Taiji; Sakuyama, Seiki
- 作者He, Ran; Fujino, Masahisa; Akaike, Masatake; Suga, Tadatomo; Sakai, Taiji; Sakuyama, Seiki
- 文件大小1457.05KB
- 发表时间2017
- DOI10.1109/ICEPT.2017.8046582
- 页码865-870