[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Modelling power LEDs in the COB case with thermal phenomena taken into account
- 作者Gorecki, Krzysztof; Ptak, Przemyslaw
- 文件大小392.67KB
- 发表时间2017
- DOI10.23919/EMPC.2017.8346884
- 页码1-6
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