Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging
- 期刊名称Composites Part A: Applied Science and Manufacturing
- 作者Lee, Dongju; Lee, Seyong; Byun, Segi; Paik, Kyung-Wook; Ho Song, Sung
- 印刷ISSN1359-835X
- 文件大小1378.67KB
- 发表时间2018-1
- DOI10.1016/j.compositesa.2018.01.009
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