Feasibility Study of the Impregnation of a No-Insulation HTS Coil Using Solder
- 期刊名称IEEE Transactions on Applied Superconductivity
- 作者Li, Yuqian; Hu, Daoyu; Zhang, Jianwen; Wu, W.; Li, Zhuyong; Ryu, K.; Hong, Zhiyong; Jin, Zhijian
- 卷第28卷
- 期第1期
- 印刷ISSN1051-8223
- 电子ISSN1558-2515
- 文件大小584.17KB
- 发表时间2018-1
- DOI10.1109/TASC.2017.2773831
- 页码1-5
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[IEEE 2017 IEEE Symposium Series on Computational Intelligence (SSCI) - Honolulu, HI (2017.11.27-2017.12.1)] 2017 IEEE Symposium Series on Computational Intelligence (SSCI) - Copyright page2017
[IEEE 2017 IEEE Symposium Series on Computational Intelligence (SSCI) - Honolulu, HI (2017.11.27-2017.12.1)] 2017 IEEE Symposium Series on Computational Intelligence (SSCI) - Cover page2017
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