Thermal characterization of full-scale PCM products and numerical simulations, including hysteresis, to evaluate energy impacts in an envelope application

• 期刊名称Applied Thermal Engineering
• 作者Biswas, Kaushik; Shukla, Yash; Desjarlais, Andre; Rawal, Rajan
• 印刷ISSN1359-4311
• 文件大小2326.32KB
• 发表时间2018-4
• DOI10.1016/j.applthermaleng.2018.04.090