Sequential Buildup of Broadband Equivalent Circuit Model for Low-Cost SMA Connectors

• 期刊名称IEEE Transactions on Electromagnetic Compatibility
• 作者Mandic, Tvrtko; Magerl, Marko; Baric, Adrijan
• 印刷ISSN0018-9375
• 电子ISSN1558-187X
• 文件大小2119.86KB
• 发表时间2018
• DOI10.1109/TEMC.2018.2817026
• 页码1-9