Numerical simulation of residual stress in laser based additive manufacturing process
Panda, Bibhu Kalyan; Sahoo, Seshadev
- 期刊名称IOP Conference Series: Materials Science and Engineering
- 作者Panda, Bibhu Kalyan; Sahoo, Seshadev
- 卷第338卷
- 印刷ISSN1757-8981
- 电子ISSN1757-899X
- 文件大小339.00KB
- 发表时间2018-03
- DOI10.1088/1757-899X/338/1/012030