Fan-Out Wafer-Level Packaging for Heterogeneous Integration

Lau, John H.; Li, Ming; Qingqian, Margie Li; Chen, Tony; Xu, Iris; Yong, Qing Xiang; Cheng, Zhong; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu-Ming; Ng, Eric; Lo, Penny; Kai, Wu; Hao, Ji; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N. C.; Ko, Cheng-Ta; Yang, Henry; Chen, Yu-Hua; Tao, Mian; Lo, Jeffery; Lee, Ricky S. W.

期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
作者Lau, John H.; Li, Ming; Qingqian, Margie Li; Chen, Tony; Xu, Iris; Yong, Qing Xiang; Cheng, Zhong; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu-Ming; Ng, Eric; Lo, Penny; Kai, Wu; Hao, Ji; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N. C.; Ko, Cheng-Ta; Yang, Henry; Chen, Yu-Hua; Tao, Mian; Lo, Jeffery; Lee, Ricky S. W.
印刷ISSN2156-3950
电子ISSN2156-3985
文件大小5687.54KB
发表时间2018
DOI10.1109/TCPMT.2018.2848649
页码1-17

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Fan-Out Wafer-Level Packaging for Heterogeneous Integration