Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Li, Margie; Lin, Curry; Lin, J. W.; Chen, Tony; Xu, Iris; Chang, Chieh-Lin; Pan, Jhih-Yuan; Wu, Hsing-Hui; Yong, Qing Xiang; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu-Ming; Ng, Eric; Kai, Wu; Hao, Ji; Beica, Rozalia; Lin, Marc; Chen, Yu-Hua; Cheng, Zhong; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Lim, Sze Pei; Lee, N. C.; Tao, Mian; Lo, Jeffery; Lee, Ricky S. W.

期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
作者Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Li, Margie; Lin, Curry; Lin, J. W.; Chen, Tony; Xu, Iris; Chang, Chieh-Lin; Pan, Jhih-Yuan; Wu, Hsing-Hui; Yong, Qing Xiang; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu-Ming; Ng, Eric; Kai, Wu; Hao, Ji; Beica, Rozalia; Lin, Marc; Chen, Yu-Hua; Cheng, Zhong; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Lim, Sze Pei; Lee, N. C.; Tao, Mian; Lo, Jeffery; Lee, Ricky S. W.
印刷ISSN2156-3950
电子ISSN2156-3985
文件大小5244.83KB
发表时间2018
DOI10.1109/TCPMT.2018.2848665
页码1-12

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Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration