[ASME ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, California, USA (Monday 27 August 2018)] ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide

• 作者Jaeger, Richard C.; Chen, Jun; Suhling, Jeffrey C.; Fursin, Leonid
• 文件大小1888.37KB
• 发表时间2018
• DOI10.1115/IPACK2018-8219