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[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - A Metal Interconnection Using a Direct Imaging Method for HySiF (Hybrid System in Flexible) Devices

[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - A Metal Interconnection Using a Direct Imaging Method for HySiF (Hybrid System in Flexible) Devices

Song, Joon Yub; Kim, Yongjin; Lee, Jae Hak; Kim, Seung Man

作者Song, Joon Yub; Kim, Yongjin; Lee, Jae Hak; Kim, Seung Man
文件大小7.27KB
发表时间2018
DOI10.1109/ESTC.2018.8546354
页码1-4

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