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Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications

Zhang, Hongqiang; Wang, Wengan; Bai, Hailin; Zou, Guisheng; Liu, Lei; Peng, Peng; Guo, Wei

期刊名称Journal of Alloys and Compounds
作者Zhang, Hongqiang; Wang, Wengan; Bai, Hailin; Zou, Guisheng; Liu, Lei; Peng, Peng; Guo, Wei
卷第774卷
印刷ISSN0925-8388
文件大小2834.37KB
发表时间2019-02
DOI10.1016/j.jallcom.2018.10.067
页码487-494