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Effects of Thermal Exposure on the Microstructure and Mechanical Properties of Al-Si-Cu-Ni-Mg-Gd Alloy

Effects of Thermal Exposure on the Microstructure and Mechanical Properties of Al-Si-Cu-Ni-Mg-Gd Alloy

Sui, Yudong; Han, Lina; Wang, Qudong
  • 期刊名称Journal of Materials Engineering and Performance
  • 作者Sui, Yudong; Han, Lina; Wang, Qudong
  • 印刷ISSN1059-9495
  • 电子ISSN1544-1024
  • 文件大小2163.24KB
  • 发表时间2019-1-18
  • DOI10.1007/s11665-018-3835-3
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