发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

Development an identification method of friction coefficient between wafer and carrier in double-sided lapping

Development an identification method of friction coefficient between wafer and carrier in double-sided lapping

Hashimoto, Yohei; Sano, Tomoya; Furumoto, Tatsuaki; Hosokawa, Akira
  • 期刊名称Precision Engineering
  • 作者Hashimoto, Yohei; Sano, Tomoya; Furumoto, Tatsuaki; Hosokawa, Akira
  • 印刷ISSN0141-6359
  • 文件大小1041.17KB
  • 发表时间2019-2
  • DOI10.1016/j.precisioneng.2019.01.005
← 返回【学霸图书馆】主页