Development an identification method of friction coefficient between wafer and carrier in double-sided lapping
Hashimoto, Yohei; Sano, Tomoya; Furumoto, Tatsuaki; Hosokawa, Akira
- 期刊名称Precision Engineering
- 作者Hashimoto, Yohei; Sano, Tomoya; Furumoto, Tatsuaki; Hosokawa, Akira
- 印刷ISSN0141-6359
- 文件大小1041.17KB
- 发表时间2019-2
- DOI10.1016/j.precisioneng.2019.01.005