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Influence of a soldering process on thermal parameters of large power LED modules

Influence of a soldering process on thermal parameters of large power LED modules

Dziurdzia, Barbara; Gorecki, Krzysztof; Ptak, Przemyslaw

期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
作者Dziurdzia, Barbara; Gorecki, Krzysztof; Ptak, Przemyslaw
印刷ISSN2156-3950
电子ISSN2156-3985
文件大小1997.72KB
发表时间2019
DOI10.1109/TCPMT.2019.2898713
页码1-1

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