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[IEEE 2019 IEEE/ACM International Conference on Technical Debt (TechDebt) - Montreal, QC, Canada (2019.5.26-2019.5.26)] 2019 IEEE/ACM International Conference on Technical Debt (TechDebt) - Mitigating Technical and Architectural Debt with Sonargraph

[IEEE 2019 IEEE/ACM International Conference on Technical Debt (TechDebt) - Montreal, QC, Canada (2019.5.26-2019.5.26)] 2019 IEEE/ACM International Conference on Technical Debt (TechDebt) - Mitigating Technical and Architectural Debt with Sonargraph

von Zitzewitz, Alexander

作者von Zitzewitz, Alexander
文件大小320.15KB
发表时间2019
DOI10.1109/TechDebt.2019.00022
页码66-67

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