Impact of Electrostatic Coupling on Monolithic 3D-enabled Network on Chip
- 期刊名称ACM Transactions on Design Automation of Electronic Systems
- 作者Lee, Dongjin; Das, Sourav; Doppa, Janardhan Rao; Pande, Partha Pratim; Chakrabarty, Krishnendu
- 卷第24卷
- 期第6期
- 印刷ISSN1084-4309
- 文件大小2919.29KB
- 发表时间2019-09-17
- DOI10.1145/3357158
- 页码1-22
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