Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect
Mahajan, Ravi; Qian, Zhiguo; Viswanath, Ram S.; Srinivasan, Sriram; Aygun, Kemal; Jen, Wei-Lun; Sharan, Sujit; Dhall, Ashish
- 期刊名称IEEE Transactions on Components, Packaging and Manufacturing Technology
- 作者Mahajan, Ravi; Qian, Zhiguo; Viswanath, Ram S.; Srinivasan, Sriram; Aygun, Kemal; Jen, Wei-Lun; Sharan, Sujit; Dhall, Ashish
- 卷第9卷
- 期第10期
- 印刷ISSN2156-3950
- 电子ISSN2156-3985
- 文件大小4668.37KB
- 发表时间2019-10
- DOI10.1109/TCPMT.2019.2942708
- 页码1952-1962