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[IEEE 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy (2019.9.25-2019.9.27)] 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Thermal Investigation of AlGaN-GaN Multilayer Structures

[IEEE 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy (2019.9.25-2019.9.27)] 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Thermal Investigation of AlGaN-GaN Multilayer Structures

Mitterhuber, Lisa; Hammer, Rene; Dengg, Thomas; Fladischer, Katrin; Spitaler, Jurgen
  • 作者Mitterhuber, Lisa; Hammer, Rene; Dengg, Thomas; Fladischer, Katrin; Spitaler, Jurgen
  • 文件大小805.42KB
  • 发表时间2019
  • DOI10.1109/therminic.2019.8923823
  • 页码1-6
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