[IEEE 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Wroclaw, Poland (2019.5.15-2019.5.19)] 2019 42nd International Spring Seminar on Electronics Technology (ISSE) - Impact of Warpage Effects on Quality and Reliability of Solder Joints
Albrecht, Oliver; Wohlrabe, Heinz; Meier, Karsten
- 作者Albrecht, Oliver; Wohlrabe, Heinz; Meier, Karsten
- 文件大小1134.65KB
- 发表时间2019
- DOI10.1109/isse.2019.8810270
- 页码1-6