[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - The Analysis for Bump Resistance Improvement by Optimizing the Sputter Condition
Su, Ming-Sin; Wang, Chang-Ning; Tsai, Clair; Yang, T. L.; Yang, Rolance; Wu, W. C.; Liu, C. S.; Chiu, J. M.; Chen, Y. F.; Pang, Ponder; Ku, Harry; Wang, Kirin; Su, C.H.; Hsu, Steven; Lu, Calvin; Liu, K. C.; Liao, Marvin
- 作者Su, Ming-Sin; Wang, Chang-Ning; Tsai, Clair; Yang, T. L.; Yang, Rolance; Wu, W. C.; Liu, C. S.; Chiu, J. M.; Chen, Y. F.; Pang, Ponder; Ku, Harry; Wang, Kirin; Su, C.H.; Hsu, Steven; Lu, Calvin; Liu, K. C.; Liao, Marvin
- 文件大小276.54KB
- 发表时间2019
- DOI10.1109/ECTC.2019.00182
- 页码1175-1178