Extreme Low Interfacial Thermal Resistance Heat Conductive Sheet Design
Tomikawa, Masao; Shimada, Akira
- 期刊名称Transactions of The Japan Institute of Electronics Packaging
- 作者Tomikawa, Masao; Shimada, Akira
- 卷第12卷
- 印刷ISSN1883-3365
- 电子ISSN1884-8028
- 文件大小484.18KB
- 发表时间2019
- DOI10.5104/jiepeng.12.E18-007-1