[IEEE 2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) - Hsinchu, Taiwan (2019.9.6-2019.9.6)] 2019 Joint International Symposium on e-Manufacturing & Design Collaboration(eMDC) & Semiconductor Manufacturing (ISSM) - Tungsten Gate Replacement Process Optimization in 3D NAND Memory
Luoh, Tuung; Huang, YuKai; Chen, Chi-Min; Hung, Yung-Tai; Yang, Lin-Wuu; Yang, Tahone; Chen, Kuang-Chao
- 作者Luoh, Tuung; Huang, YuKai; Chen, Chi-Min; Hung, Yung-Tai; Yang, Lin-Wuu; Yang, Tahone; Chen, Kuang-Chao
- 文件大小3439.43KB
- 发表时间2019
- DOI10.23919/eMDC/ISSM48219.2019.9052087
- 页码1-4