Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint

• 期刊名称Journal of Alloys and Compounds
• 作者Cheng, Jinxuan; Hu, Xiaowu; Li, Qinglin
• 卷第832卷
• 印刷ISSN0925-8388
• 文件大小5686.31KB
• 发表时间2020-08
• DOI10.1016/j.jallcom.2020.155006