Fabrication and electrical characteristics of a novel interposer with polymer liner and silicon pillars with ultra-low-resistivity as through-silicon-vias (TSVs) for 2.5D/3D applicationsChen, Qian-Wen; Yan, Yang-Yang; Ding, Ying-Tao; Wang, Shi-Wei; Wang, Wei-Jiang · Microsystem Technologies · 2015

Spectral Emissivity of SiliconSatō, Tsutomu · Japanese Journal of Applied Physics · 1967

Surface Acoustic Wave SensorsShiokawa, Showko; Kondoh, Jun · Japanese Journal of Applied Physics · 2004

Perspectives in SonochemistryAndo, Takashi; Kimura, Takahide · Japanese Journal of Applied Physics · 2003

Structurally Stable Hyperbolic BeamChakraborty, Rijuparna; Ghosh, Ajay · Japanese Journal of Applied Physics · 2009

Peierls Phase TransitionKagoshima, Seiichi · Japanese Journal of Applied Physics · 1981

Piezoelectric Tensor of KNbO <sub/>3</sub>Günter, P. · Japanese Journal of Applied Physics · 1977

Plasma Anodic Oxidation of InPFuyuki, Takashi; Moriuchi, Sohta; Matsunami, Hiroyuki · Japanese Journal of Applied Physics · 1983

Linearity Characteristics of Multiplier PhototubesNonaka, Mamoru; Kashima, Takeo · Japanese Journal of Applied Physics · 1963