![New profile of ultra low stress resin encapsulants for large chip semiconductor devices : Yoshinobu Nakamura, Shinjirou Uenishi, Teruo Kunishi, Kazuyuki Miki, Haruo Tabata, Kazuyuki Kuwada, Hideto Suzuki and Tsunetaka Matsumoto. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 502 (1987)]()
New profile of ultra low stress resin encapsulants for large chip semiconductor devices : Yoshinobu Nakamura, Shinjirou Uenishi, Teruo Kunishi, Kazuyuki Miki, Haruo Tabata, Kazuyuki Kuwada, Hideto Suzuki and Tsunetaka Matsumoto. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 502 (1987)1989