[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Flip chip back end design parameters to reduce bump electromigrationKarajgikar, Saket; Nagaraj, Vishal; Agonafer, Dereje; Pekin, Senol · 2008