![[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Liquid-state interfacial reaction of Sn-10Sb-5Cu high temperature lead-free solder and Cu substrate]()
[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Liquid-state interfacial reaction of Sn-10Sb-5Cu high temperature lead-free solder and Cu substrateQiulian Zeng, ; Jianjun Guo, ; Xiaolong Gu, ; Xinbing Zhao, · 2008