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New avenues for failure analysisW.J. Plumbridge · 2009
Mechano-environmental effects in fatigueW.J. Plumbridge · 1977
Tin pest in electronics?Plumbridge, W.J. · Circuit World · 2007
Tin pest in lead‐containing soldersPlumbridge, W.J. · Soldering & Surface Mount Technology · 2010
Residual stress effects during fatigue crack growthW.J. Plumbridge; N. Knee · 1985
Implementing lead‐free solders – the performance aspectsPlumbridge, W.J. · Soldering & Surface Mount Technology · 2006
Fatigue crack growth in liquids under pressureW.J. Plumbridge; P.J. Ross; J.S.C. Parry · 1985
Low cycle fatigue of a titanium 829 alloyW.J. Plumbridge; M. Stanley · 1986
Diffusion SolderingJacobson, D.M.; Humpston, G. · Soldering & Surface Mount Technology · 1992
Voiding Mechanisms in SMTHance, W.B.; Lee, N.C. · Soldering & Surface Mount Technology · 1993
Assembly with Conductive AdhesivesGilleo, K. · Soldering & Surface Mount Technology · 1995
Voiding in BGAsO'Hara, W.B.; Lee, N.‐C. · Soldering & Surface Mount Technology · 1995
SMART group newsPryor, Gordon · Soldering & Surface Mount Technology · 1995
New ProductsSoldering & Surface Mount Technology · 1989
Industry newsSoldering & Surface Mount Technology · 1992
SMART group newsSoldering & Surface Mount Technology · 1989