![[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Experimental investigation on microstructural influence towards visco-plastic mechanical properties of Sn-based solder alloy for material modelling in finite element simulations]()
[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Experimental investigation on microstructural influence towards visco-plastic mechanical properties of Sn-based solder alloy for material modelling in finite element simulationsMetasch, R.; Schwerz, R.; Roellig, M.; Kabakchiev, A.; Metais, B.; Ratchev, R.; Wolter, K.-J. · 2015