![[IEEE 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Glasgow, United Kingdom (2013.09.3-2013.09.5)] 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Micro-texture dependence of stress-induced migration of electroplated copper thin film interconnections used for 3D integration]()
[IEEE 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Glasgow, United Kingdom (2013.09.3-2013.09.5)] 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Micro-texture dependence of stress-induced migration of electroplated copper thin film interconnections used for 3D integrationSuzuki, Ken; Miura, Hideo; Asai, Osamu; Furuya, Ryosuke; Sung, Jaeuk; Murata, Naokazu · 2013