[IEEE 1997 IEEE MTT-S International Microwave Symposium Digest - Denver, CO, USA (8-13 June 1997)] 1997 IEEE MTT-S International Microwave Symposium Digest - A generalized 3D subgrid technique for the finite-difference time domain method
- 作者Ritter, J.; Arndt, F.
- 卷第3卷
- 文件大小358.70KB
- 发表时间1997
- DOI10.1109/mwsym.1997.596644
- 页码1563-1566
同作者推荐
[IEEE 2002 8th International Advanced Packaging Materials Symposium - Stone Mountain, GA, USA (3-6 March 2002)] 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) - Evaluation, optimization, and reliability of no-flow underfill processColella, M.; Baldwin, D. · 2002
[IEEE 2004 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Atlanta, GA, USA (24-26 March 2004)] 2004 1st IEEE Consumer Communications and Networking Conference (IEEE Cat. No.04EX745) - Void free processing of flip chip on board assemblies using no-flow underfillsColella, M.; Baldwin, D. · 2004