![[IEEE 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Timisoara, Romania (2011.10.20-2011.10.23)] 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Optimization of breaking processes in LTCC manufacturing]()
[IEEE 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Timisoara, Romania (2011.10.20-2011.10.23)] 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Optimization of breaking processes in LTCC manufacturingHorvath, Eszter; Erenyi, Andras; Geczy, Attila; Harsanyi, Gabor · 2011