Editor's Introduction
- 期刊名称Organization Management Journal
- 作者Meisel, Steve
- 卷第2卷
- 期第2期
- 电子ISSN1541-6518
- 文件大小51.82KB
- 发表时间2005-09
- DOI10.1057/omj.2005.14
- 页码69-69
Wafer-Level Modular Testing of Core-Based SoCsBahukudumbi, Sudarshan; Chakrabarty, Krishnendu · IEEE Transactions on Very Large Scale Integration (VLSI) Systems · 2007
Power-aware SoC test planning for effective utilization of port-scalable testersSehgal, Anuja; Bahukudumbi, Sudarshan; Chakrabarty, Krishnendu · ACM Transactions on Design Automation of Electronic Systems · 2008
[IEEE 2008 17th Asian Test Symposium (ATS) - Hokkaido, Japan (2008.11.24-2008.11.27)] 2008 17th Asian Test Symposium - Power Management for Wafer-Level Test During Burn-InBahukudumbi, Sudarshan; Chakrabarty, Krishnendu · 2008
[IEEE 2008 Design, Automation and Test in Europe - Munich, Germany (2008.03.10-2008.03.14)] 2008 Design, Automation and Test in Europe - Test Scheduling for Wafer-Level Test-During-Burn-In of Core-Based SoCsBahukudumbi, Sudarshan; Chakrabarty, Krishnendu; Kacprowicz, Richard · 2008
[IEEE 2006 IEEE International Test Conference - Santa Clara, CA, USA (2006.10.22-2006.10.27)] 2006 IEEE International Test Conference - Defect-Oriented and Time-Constrained Wafer-Level Test-Length Selection for Core-Based Digital SoCsBahukudumbi, Sudarshan; Chakrabarty, Krishnendu · 2006
[ACM Press the conference - Munich, Germany (2008.03.10-2008.03.14)] Proceedings of the conference on Design, automation and test in Europe - DATE '08 - Test scheduling for wafer-level test-during-burn-in of core-based SoCsBahukudumbi, Sudarshan; Chakrabarty, Krishnendu; Kacprowicz, Richard · 2008
[IEEE 2007 Asia and South Pacific Design Automation Conference - Yokohama, Japan (2007.01.23-2007.01.26)] 2007 Asia and South Pacific Design Automation Conference - AWafer-Level Defect Screening Technique to Reduce Test and Packaging Costs for "Big-D/Small-A" Mixed-Signal SoCsBahukudumbi, Sudarshan; Ozev, Sule; Chakrabarty, Krishnendu; Iyengar, Vikram · 2007