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[IEEE 2005 Proceedings. 55th Electronic Components and Technology Conference - Lake Buena Vista, FL (2005.05.31-2005.06.3)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Novel Hermetic Wafer-Level-Packaging Technology using Low-Temperature Passivation

[IEEE 2005 Proceedings. 55th Electronic Components and Technology Conference - Lake Buena Vista, FL (2005.05.31-2005.06.3)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Novel Hermetic Wafer-Level-Packaging Technology using Low-Temperature Passivation

Leib, J.; Mund, D.; Topper, M.
  • 作者Leib, J.; Mund, D.; Topper, M.
  • 文件大小909.74KB
  • 发表时间2005
  • DOI10.1109/ectc.2005.1441323
  • 页码562-565
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