![[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Development of wafer thinning and double-sided bumping technologies for the three-dimensional stacked LSI]()
[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Development of wafer thinning and double-sided bumping technologies for the three-dimensional stacked LSISunohara, M.; Fujii, T.; Hoshino, M.; Yonemura, H.; Tomisaka, M.; Takahashi, K. · 2002