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[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Calibration of Equivalent Finite Element Model for Packaged Printed Circuit Board by Experimental Modal Analysis

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Calibration of Equivalent Finite Element Model for Packaged Printed Circuit Board by Experimental Modal Analysis

Lee, Ying-Chih; Wang, Bor-Tsuen; Lail, Yi-Shao; Yeh, Chang-Lin; Chen, Rong-Sheng
  • 作者Lee, Ying-Chih; Wang, Bor-Tsuen; Lail, Yi-Shao; Yeh, Chang-Lin; Chen, Rong-Sheng
  • 文件大小5103.05KB
  • 发表时间2008
  • DOI10.1109/eptc.2008.4763471
  • 页码424-428
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