[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Calibration of Equivalent Finite Element Model for Packaged Printed Circuit Board by Experimental Modal Analysis
Lee, Ying-Chih; Wang, Bor-Tsuen; Lail, Yi-Shao; Yeh, Chang-Lin; Chen, Rong-Sheng
- 作者Lee, Ying-Chih; Wang, Bor-Tsuen; Lail, Yi-Shao; Yeh, Chang-Lin; Chen, Rong-Sheng
- 文件大小5103.05KB
- 发表时间2008
- DOI10.1109/eptc.2008.4763471
- 页码424-428