![[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Effects of thermal aging on the electrical resistance of Sn-3.5Ag micro SOH solder joints]()
[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Effects of thermal aging on the electrical resistance of Sn-3.5Ag micro SOH solder jointsPeng, Jin; Wu, Fengshun; Liu, Hui; Zhou, Longzao; Pan, Qilin · 2009