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[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Measurement of die stress distributions in flip chip CBGA packaging

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Measurement of die stress distributions in flip chip CBGA packaging

Roberts, Jordan; Hussain, Safina; Rahim, M. Kaysar; Motalab, Mohammad; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep; Zhang, Ron
  • 作者Roberts, Jordan; Hussain, Safina; Rahim, M. Kaysar; Motalab, Mohammad; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep; Zhang, Ron
  • 文件大小3180.90KB
  • 发表时间2010
  • DOI10.1109/itherm.2010.5501285
  • 页码1-13
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