[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Measurement of die stress distributions in flip chip CBGA packaging
Roberts, Jordan; Hussain, Safina; Rahim, M. Kaysar; Motalab, Mohammad; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep; Zhang, Ron
- 作者Roberts, Jordan; Hussain, Safina; Rahim, M. Kaysar; Motalab, Mohammad; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep; Zhang, Ron
- 文件大小3180.90KB
- 发表时间2010
- DOI10.1109/itherm.2010.5501285
- 页码1-13