![SPIE Proceedings [SPIE SPIE Microtechnologies - Grenoble, France (Wednesday 24 April 2013)] Smart Sensors, Actuators, and MEMS VI - Analysis of thermal vias in molded interconnect devices]()
SPIE Proceedings [SPIE SPIE Microtechnologies - Grenoble, France (Wednesday 24 April 2013)] Smart Sensors, Actuators, and MEMS VI - Analysis of thermal vias in molded interconnect devicesReitterer, Jörg; Fidler, Franz; Saint Julien-Wallsee, Ferdinand; Barth, Maximilian; Eberhardt, Wolfgang; Keßler, Ulrich; Kück, Heinz; Schmid, Ulrich; Schmid, Ulrich; Sánchez de Rojas Aldavero, José Luis; Leester-Schaedel, Monika · 2013