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[IEEE 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - Berlin, Germany (2015.5.10-2015.5.13)] 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - Author index2015
[IEEE 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - Berlin, Germany (2015.5.10-2015.5.13)] 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - Table of contents2015
[IEEE 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - Berlin, Germany (2015.5.10-2015.5.13)] 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - Power plane noise coupling to high speed signalsDemuynck, Filip; Eichinger, Ludwig; Poisson, Vincent · 2015
[IEEE 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - Berlin, Germany (2015.5.10-2015.5.13)] 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - Simulation methodology for enhancement of power delivery network decouplingBenoit, Goral; Cyrille, Gautier; Alexandre, Amedeo · 2015
[IEEE 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - Berlin, Germany (2015.5.10-2015.5.13)] 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - Common mode effects in high speed serial linksKarlsson, Ingvar · 2015
[IEEE 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - Berlin, Germany (2015.5.10-2015.5.13)] 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - IBIS model formulation and extraction for SPI evaluationDghais, Wael; Rodriguez, Jonathan · 2015
[IEEE 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - Berlin, Germany (2015.5.10-2015.5.13)] 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - Scalable power delivery design methodology for SoC on cost driven platformsCai, Kinger Xingjian; Ji, Steven Yun · 2015
[IEEE 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - Berlin, Germany (2015.5.10-2015.5.13)] 2015 IEEE 19th Workshop on Signal and Power Integrity (SPI) - A node clustering reduction scheme for power grids electrothermal analysisMagnani, A.; de Magistris, M.; Maffucci, A.; Todri-Sanial, A. · 2015
Electrical characterization and structure investigation of quad flat non-lead package for RFIC applicationsNansen Chen; Kevin Chiang; T.D Her; Yeong-Lin Lai; Chichyang Chen · 2003
Evaluation of multi-Gbps serial link using wire-bonded multiple exposed pads (M-pad) leadframe packageNansen Chen; Hongchin Lin · 2009
Optimised dispensing of predatory mites by multirotor UAVs in wind: A distribution pattern modelling approach for precision pest managementTeske, April L.; Chen, Gang; Nansen, Christian; Kong, Zhaodan · Biosystems Engineering · 2019
Use of banker plant system for sustainable management of the most important insect pest in rice fields in ChinaZheng, Xusong; Lu, Yanhui; Zhu, Pingyang; Zhang, Facheng; Tian, Junce; Xu, Hongxing; Chen, Guihua; Nansen, Christian; Lu, Zhongxian · Scientific Reports · 2017
[IEEE 2001 International Semiconductor Device Research Symposium. Symposium - Washington, DC, USA (5-7 Dec. 2001)] 2001 International Semiconductor Device Research Symposium. Symposium Proceedings (Cat. No.01EX497) - Electrical characterization of quad flat non-lead package for RFIC applicationsNansen Chen, ; Chiang, K.; Her, T.D.; Yeong-Lin Lai, ; Chichyang Chen, · 2001
[IEEE 2019 IEEE CPMT Symposium Japan (ICSJ) - Kyoto, Japan (2019.11.18-2019.11.20)] 2019 IEEE CPMT Symposium Japan (ICSJ) - Power Channel Design and Verification for Automotive Chipset with Multi-Core ProcessorChen, Nansen · 2019
[IEEE 2007 International Symposium on Signals, Systems and Electronics - Montreal, QC, Canada (2007.07.30-2007.08.2)] 2007 International Symposium on Signals, Systems and Electronics - Design of Costless and Adjustable Inductors Embedded in Array PackagesChen, Nansen; Lin, Hongchin · 2007
[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - A two-layer board intellectual property to reduce electromagnetic radiationNansen Chen, ; Hongchin Lin, · 2010