![Dynamic Scaling Exponents of Copper Electrodeposits from Scanning Force Microscopy Imaging. Influence of a Thiourea Additive on the Kinetics of Roughening and Brightening]()
Dynamic Scaling Exponents of Copper Electrodeposits from Scanning Force Microscopy Imaging. Influence of a Thiourea Additive on the Kinetics of Roughening and BrighteningMendez, S.; Andreasen, G.; Schilardi, P.; Figueroa, M.; Vázquez, L.; Salvarezza, R. C.; Arvia, A. J. · Langmuir · 1998