![[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Characterization of microprocessor chip stress distributions during component packaging and thermal cycling]()
[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Characterization of microprocessor chip stress distributions during component packaging and thermal cyclingRoberts, Jordan; Hussain, Safina; Rahim, M. Kaysar; Motalab, Mohammad; Suhling, Jeffrey C.; Jaeger, Richard C.; Lall, Pradeep; Zhang, Ron · 2010