![[IEEE 2015 IEEE 35th International Conference on Electronics and Nanotechnology (ELNANO) - Kyiv, Ukraine (2015.4.21-2015.4.24)] 2015 IEEE 35th International Conference on Electronics and Nanotechnology (ELNANO) - Packaging problem in microelectronics due to stress and fracture at the “metal-ceramic” interface]()
[IEEE 2015 IEEE 35th International Conference on Electronics and Nanotechnology (ELNANO) - Kyiv, Ukraine (2015.4.21-2015.4.24)] 2015 IEEE 35th International Conference on Electronics and Nanotechnology (ELNANO) - Packaging problem in microelectronics due to stress and fracture at the “metal-ceramic” interfaceKorobova, N.; Timoshenkov, S.; Britkov, O.; Shepelev, S.; Mikheev, A. · 2015