![[IEEE 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - Delft, Netherlands (2017.4.5-2017.4.7)] 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - A study on packaging design of SiC power module using near-field magnetic scanning techniques]()
[IEEE 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - Delft, Netherlands (2017.4.5-2017.4.7)] 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - A study on packaging design of SiC power module using near-field magnetic scanning techniquesIbuchi, Takaaki; Masuda, Eisuke; Funaki, Tsuyoshi; Otake, Hirotaka; Miyazaki, Tatsuya; Kanetake, Yasuo; Nakamura, Takashi · 2017