[IEEE 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - Delft, Netherlands (2017.4.5-2017.4.7)] 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - A study on packaging design of SiC power module using near-field magnetic scanning techniques
Ibuchi, Takaaki; Masuda, Eisuke; Funaki, Tsuyoshi; Otake, Hirotaka; Miyazaki, Tatsuya; Kanetake, Yasuo; Nakamura, Takashi
- 作者Ibuchi, Takaaki; Masuda, Eisuke; Funaki, Tsuyoshi; Otake, Hirotaka; Miyazaki, Tatsuya; Kanetake, Yasuo; Nakamura, Takashi
- 文件大小655.91KB
- 发表时间2017
- DOI10.1109/IWIPP.2017.7936770
- 页码1-4