Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D Network-on-Chip
- 期刊名称ACM Transactions on Design Automation of Electronic Systems
- 作者Lee, Dongjin; Das, Sourav; Doppa, Janardhan Rao; Pande, Partha Pratim; Chakrabarty, Krishnendu
- 卷第23卷
- 期第5期
- 印刷ISSN1084-4309
- 文件大小5128.48KB
- 发表时间2018-08-22
- DOI10.1145/3223046
- 页码1-25
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