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[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Piezoresistive Sensor Array Design for Shoe-integrated Continuous Body Weight and Gait Measurement

[IEEE 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Paris, France (2019.5.12-2019.5.15)] 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Piezoresistive Sensor Array Design for Shoe-integrated Continuous Body Weight and Gait Measurement

Muzaffar, Shahzad; Elfadel, Ibrahim Abe M.
  • 作者Muzaffar, Shahzad; Elfadel, Ibrahim Abe M.
  • 文件大小1747.16KB
  • 发表时间2019
  • DOI10.1109/dtip.2019.8752629
  • 页码1-4
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