[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Reducing SSN by Mismatching TechniqueHuang, Huifen; Chu, QingXin; Xiao, Jiankang · 2007

[IEEE 2008 China-Japan Joint Microwave Conference (CJMW 2008) - Shanghai, China (2008.09.10-2008.09.12)] 2008 China-Japan Joint Microwave Conference - Triangular Patch Resonator Bandpass Filter with Higher Order Mode OperationJianKang, Xiao; QingXin, Chu; HuiFen, Huang · 2008

[IEEE 2009 Asia Pacific Microwave Conference - (APMC 2009) - Singapore, Singapore (2009.12.7-2009.12.10)] 2009 Asia Pacific Microwave Conference - A novel fractal PCB power plane for power integrity in high speed mixed signal systemHuang, HuiFen; Chu, QingXin; Xie, ZeMing; Xiao, JianKang · 2009

[IEEE 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility - Beijing, China (2010.04.12-2010.04.16)] 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility - Novel on chip power distribution technique based on plant veinHuiFen Huang, ; QingXin Chu, ; Sy, Liu; JianKang Xiao, · 2010

[IEEE 2008 International Conference on Microwave and Millimeter Wave Technology (ICMMT) - Nanjing, China (2008.04.21-2008.04.24)] 2008 International Conference on Microwave and Millimeter Wave Technology - A novel power plane structure for EMC design for modern system in packageHuiFen Huang, ; QingXin Chu, ; JianKang Xiao, · 2008

[IEEE 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Shatin, Hong Kong, China (2009.12.2-2009.12.4)] 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) - A novel on-chip fractal power tree network based on leaf vein gridsHuiFen Huang, ; QingXin Chu, ; JianKang Xiao, · 2009